In brief
Doosan Group announced a 550‑billion‑won ($405 million) investment to expand copper‑clad laminate production in Changshu, China, as artificial‑intelligence data centers increase demand for advanced printed circuit board materials. The new facility, part of a broader 970‑billion‑won plan, will begin operations in the second half of 2028. The expansion underscores the pivotal role of CCL in AI accelerator, network switch, and optical module manufacturing.
Doosan Group is expanding its copper‑clad laminate production in Changshu, Japan, with a 550‑billion‑won investment, a move designed to power the rapid growth of artificial‑intelligence data‑center hardware.
Copper‑clad laminate (CCL) is a composite material that consists of a copper‑coated polymer substrate, used in printed circuit boards (PCBs) to carry electromagnetic signals in high‑frequency electronics. In AI accelerators, network switches, and optical modules, CCL provides the essential thermal management and low‑loss pathways that enable data centers to scale computing power efficiently.
On November 5, 2026, Doosan and Changshu’s municipal authorities signed an investment agreement at Suzhou City Hall, laying the groundwork for a 185,000‑square‑meter production line adjacent to Doosan’s existing plant. The agreement marks the first of several construction phases, with the facility slated to start operations in the second half of 2028.
The expansion is part of a larger 970‑billion‑won initiative announced in September, which aims to chronologically grow Doosan’s CCL output across multiple locations worldwide. By targeting the Chinese market—a fast‑growing base for data‑center construction—Doosan is aligning its supply chain with the region’s intensifying AI needs.
Doosan’s strategic focus on CCL comes as global AI workloads have surged, driving demand for specialized PCB materials that can handle higher power densities and advanced signal integrity. The company estimates that the new line will boost its CCL capacity by roughly 30%, allowing it to meet both domestic Chinese and international demand.
Industry analysts note that investors are watching Doosan’s expansion as a barometer for the broader shift towards low‑dielectric‑loss materials in AI hardware. The higher copper content in CCL, relative to traditional fiberglass or epoxy composites, reduces electrical resistance and heat buildup—a critical advantage for high‑frequency AI processors.
Changshu’s local government has highlighted potential economic benefits, including job creation and technology transfer. The city anticipates that the new plant will foster ancillary industries, from raw material suppliers to electronics assembly foundries, thereby amplifying the regional manufacturing ecosystem.
While Doosan’s investment is specific to CCL, the company’s broader portfolio includes other high‑performance materials such as high‑k dielectrics and flexible PCBs, reinforcing its status as a diversified supplier to advanced electronics sectors.
As AI continues to pervade sectors from autonomous vehicles to cloud computing, the demand for reliable, high‑performance CCL is set to rise. By reinforcing its production capacity in a key regional hub, Doosan is positioning itself at the nexus of material science and machine‑learning infrastructure.
In closing, Doosan’s move underscores the essential link between material innovation and the next generation of AI infrastructure, highlighting how advancements in copper‑clad laminate are quietly powering some of the world’s most powerful data‑center processors.
